Warstwy NiCuP wytwarzane w procesie bezprądowej metalizacji

Piotr Kowalik; Edyta Wróbel

doi:10.15199/48.2023.04.38

Warstwy NiCuP wytwarzane w procesie bezprądowej metalizacji

Katedra Elektroniki, Elektrotechniki i Mikroelektroniki (RAU/RAU11)

Wyniki badań: Wkład do czasopisma › Artykuł › recenzja

1 Cytowanie z bazy Scopus

Abstrakt

The paper presents the methodology of producing layers with surface resistance in the range of 0.1 ÷ 10.0Ω / . It was found that the addition of copper reduces the final resistance. The paper specifies the optimal conditions for the production of these layers. The addition of copper makes the NiCuP alloy perfectly suitable for the production of contact fields and conductive layers. An additional advantage is the ability to selectively apply these layers on various substrates.

Przetłumaczony tytuł wkładu	NiCuP layers made in the process of electroless metallization
Język oryginału	polski
Strony (od–do)	224-226
Liczba stron	3
Czasopismo	Przeglad Elektrotechniczny
Tom	99
Numer wydania	4
Identyfikatory DOI	https://doi.org/10.15199/48.2023.04.38
Status publikacji	Opublikowano - 2023

Słowa kluczowe

NiCuP
conductive layers
resistive layers
selective metallization

Obszary tematyczne ASJC Scopus

Inżynieria elektryczna i elektroniczna

Uzyskaj dostęp do dokumentu

10.15199/48.2023.04.38

Inne pliki i linki

Link do publikacji w Scopus

Cytowanie

@article{c140b86714ec4105a9f2e21bf23dea31,

title = "Warstwy NiCuP wytwarzane w procesie bezpr{\c a}dowej metalizacji",

abstract = "The paper presents the methodology of producing layers with surface resistance in the range of 0.1 {\textdiv} 10.0Ω / . It was found that the addition of copper reduces the final resistance. The paper specifies the optimal conditions for the production of these layers. The addition of copper makes the NiCuP alloy perfectly suitable for the production of contact fields and conductive layers. An additional advantage is the ability to selectively apply these layers on various substrates.",

keywords = "NiCuP, conductive layers, resistive layers, selective metallization",

author = "Piotr Kowalik and Edyta Wr{\'o}bel",

year = "2023",

doi = "10.15199/48.2023.04.38",

language = "polski",

volume = "99",

pages = "224--226",

journal = "Przeglad Elektrotechniczny",

issn = "0033-2097",

publisher = "Wydawnictwo SIGMA-NOT",

number = "4",

}

TY - JOUR

T1 - Warstwy NiCuP wytwarzane w procesie bezprądowej metalizacji

AU - Kowalik, Piotr

AU - Wróbel, Edyta

PY - 2023

Y1 - 2023

N2 - The paper presents the methodology of producing layers with surface resistance in the range of 0.1 ÷ 10.0Ω / . It was found that the addition of copper reduces the final resistance. The paper specifies the optimal conditions for the production of these layers. The addition of copper makes the NiCuP alloy perfectly suitable for the production of contact fields and conductive layers. An additional advantage is the ability to selectively apply these layers on various substrates.

AB - The paper presents the methodology of producing layers with surface resistance in the range of 0.1 ÷ 10.0Ω / . It was found that the addition of copper reduces the final resistance. The paper specifies the optimal conditions for the production of these layers. The addition of copper makes the NiCuP alloy perfectly suitable for the production of contact fields and conductive layers. An additional advantage is the ability to selectively apply these layers on various substrates.

KW - NiCuP

KW - conductive layers

KW - resistive layers

KW - selective metallization

UR - https://www.scopus.com/pages/publications/85152097754

U2 - 10.15199/48.2023.04.38

DO - 10.15199/48.2023.04.38

M3 - Artykuł

AN - SCOPUS:85152097754

SN - 0033-2097

VL - 99

SP - 224

EP - 226

JO - Przeglad Elektrotechniczny

JF - Przeglad Elektrotechniczny

IS - 4

ER -

Warstwy NiCuP wytwarzane w procesie bezprądowej metalizacji

Abstrakt

Słowa kluczowe

Obszary tematyczne ASJC Scopus

Uzyskaj dostęp do dokumentu

Inne pliki i linki

Fingerprint

Cytowanie