Abstrakt
Conventional annealing of copper/steel/copper laminates faces a fundamental thermal conflict, as the required recrystallization temperature for steel exceeds the melting point of copper. Here, pulsed current treatment (500 V, 330 Hz, 65 μs, 180 A/mm2) applied at 700 °C for 2 min results in a simultaneous increase in elongation from 15% to 54% while retaining a tensile strength of 713 MPa. Microstructural analyses reveal that accelerated copper/steel interdiffusion widens the interface by 35.7%, transforming the bonding from mechanical to metallurgical, while reduced dislocation activation energy alleviates strain accumulation and residual stress, shifting the steel-side grain-size distribution from bimodal to normal. In addition, this treatment promotes carbide phase transformation, such as the transformation from metastable CrO2 to stable Cr23C6 and CrC, thereby enhancing microstructure stability and reducing interface energy. This work demonstrates that pulsed current treatment enables precise regulation of microstructure and mechanical properties in multi-material systems, offering a viable pathway to overcome conventional annealing limitations.
| Język oryginału | angielski |
|---|---|
| Strony (od–do) | 6464-6479 |
| Liczba stron | 16 |
| Czasopismo | Journal of Materials Research and Technology |
| Tom | 42 |
| Identyfikatory DOI | |
| Status publikacji | Opublikowano - 1 maj 2026 |
Obszary tematyczne ASJC Scopus
- Ceramika i kompozyty
- Biomateriały
- Powierzchnie, powłoki i filmy
- Metale i stopy
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