Modelowanie matematyczne wymiany ciepła w prostopadłościennych kanałach modułowych urza̧dzén elektronicznych

In general the elements of electronic equipment, i.e. module plates together with semiconductor devices and external chassis create regular rectangular ducts, so called module ducts. During the operation of the electronics equipment the heat is generated in the semiconductor devices. That heat is transferred to the cooling agent which flows along the duct. In the case the cooling system works improperly, the temperature within the semiconductor element (especially in the semiconductor junction) can arise above admissible level, what can damage semiconductor element and finally the whole equipment. To avoid mentioned effects the cooling system of the electronic system should be carefully designed taking into consideration heat and flow analysis. Present paper shows the results of numerical modeling of the velocity distribution of the coolant within the duct. Influence of the velocity distribution on the temperature of the semiconductor device is analyzed.