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Kinematics of the grinding process

  • Ivanova Tatiyna Nikolaevna
  • , Muyzemnek Alexander Yurievich
  • , Jacek Sitko
  • , Witold Bialy
  • Perm National Research Polytechnic University
  • Institute of Mechanics UB RAS
  • Penza State University
  • Silesian University of Technology

Wyniki badań: Wkład do czasopismaArtykuł z konferencjirecenzja

2 Cytowania z bazy Scopus

Abstrakt

The possibility of chip removal is governed by the section thickness, properties of metal under deformation speed, geometric parameters of cutting edges of the wheel. Randomized geometry and arbitrary location of cutting edges on the work surface of grinding wheel allow the application of probabilistic-statistical approach for description of regularities of the grinding process. The main characteristics of formation of microrelief of work surface of the wheel depend on the law of difference in altitude of cutting edges and corner radiuses of their tops. The studies on the kinematics of interaction between a grinding wheel and a machined surface during face grinding showed that overlapping of scratches across the width occurs at a smaller depth. Cutting depth of a grinding wheel does not depend on the value of longitudinal and cross feed, but it is determined by the law of grain distribution in the volume of abrasive layer as well as the shape of the tops of abrasive grains. It is established that abrasive grains located in a work surface layer to the cutting depth are in the most unfavorable conditions due to their small amount and highest difference in altitude. It leads to an increase in the size of the chip, occurrence of the highest cutting forces and wear of grains.

Język oryginałuangielski
Strony (od–do)1303-1306
Liczba stron4
CzasopismoMaterials Today: Proceedings
Tom38
Identyfikatory DOI
Status publikacjiOpublikowano - wrz 2021
Wydarzenie2020 International Conference on Modern Trends in Manufacturing Technologies and Equipment 2020, ICMTMTE 2020 - Sevastopol, Federacja Rosyjska
Czas trwania: 7 wrz 202011 wrz 2020

Obszary tematyczne ASJC Scopus

  • Materiałoznawstwo ogólne

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