@inproceedings{682cc628ebff45498c9fcd3833f8b13e,
title = "Crystal structure informed mesoscale deformation model for HCP Cu6Sn5intermetallic compound",
abstract = "In the electronic packaging and energy storage sectors, the study of Cu6Sn5 intermetallic compound (IMC) is getting more attention. At temperatures above 186 °C, this IMC exists in a hexagonal closed packed (HCP) crystalline structure. Crystal plasticity finite element simulations are performed on Cu6Sn5 IMC by taking the information about its lattice parameters and direction dependent elastic properties. Three types of models corresponding to deformations in basal, prismatic and pyramidal modes are developed. With the same type of loading in the elastic regime and boundary conditions, the results of the computations reveal the differences in displacement magnitudes among the three model types.",
keywords = "Anisotropy, Crystal plasticity finite element, Deformation, Elastic regime, Hexagonal closed packed, Intermetallic compound",
author = "Anil Kunwar and Haoran Ma and Johan Hektor",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 23rd International Conference on Electronic Packaging Technology, ICEPT 2022 ; Conference date: 10-08-2022 Through 13-08-2022",
year = "2022",
doi = "10.1109/ICEPT56209.2022.9873310",
language = "English",
series = "2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022",
address = "United States",
}