Warstwy NiCuP wytwarzane w procesie bezprądowej metalizacji

Piotr Kowalik; Edyta Wróbel

doi:10.15199/48.2023.04.38

Warstwy NiCuP wytwarzane w procesie bezprądowej metalizacji

Translated title of the contribution: NiCuP layers made in the process of electroless metallization

Department of Electronics; Electrical Engineering and Microelectronics (RAU/RAU11)

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

The paper presents the methodology of producing layers with surface resistance in the range of 0.1 ÷ 10.0Ω / . It was found that the addition of copper reduces the final resistance. The paper specifies the optimal conditions for the production of these layers. The addition of copper makes the NiCuP alloy perfectly suitable for the production of contact fields and conductive layers. An additional advantage is the ability to selectively apply these layers on various substrates.

Translated title of the contribution	NiCuP layers made in the process of electroless metallization
Original language	Polish
Pages (from-to)	224-226
Number of pages	3
Journal	Przeglad Elektrotechniczny
Volume	99
Issue number	4
DOIs	https://doi.org/10.15199/48.2023.04.38
Publication status	Published - 2023

ASJC Scopus subject areas

Electrical and Electronic Engineering

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10.15199/48.2023.04.38

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title = "Warstwy NiCuP wytwarzane w procesie bezpr{\c a}dowej metalizacji",

abstract = "The paper presents the methodology of producing layers with surface resistance in the range of 0.1 {\textdiv} 10.0Ω / . It was found that the addition of copper reduces the final resistance. The paper specifies the optimal conditions for the production of these layers. The addition of copper makes the NiCuP alloy perfectly suitable for the production of contact fields and conductive layers. An additional advantage is the ability to selectively apply these layers on various substrates.",

keywords = "NiCuP, conductive layers, resistive layers, selective metallization",

author = "Piotr Kowalik and Edyta Wr{\'o}bel",

year = "2023",

doi = "10.15199/48.2023.04.38",

language = "polski",

volume = "99",

pages = "224--226",

journal = "Przeglad Elektrotechniczny",

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number = "4",

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T1 - Warstwy NiCuP wytwarzane w procesie bezprądowej metalizacji

AU - Kowalik, Piotr

AU - Wróbel, Edyta

PY - 2023

Y1 - 2023

N2 - The paper presents the methodology of producing layers with surface resistance in the range of 0.1 ÷ 10.0Ω / . It was found that the addition of copper reduces the final resistance. The paper specifies the optimal conditions for the production of these layers. The addition of copper makes the NiCuP alloy perfectly suitable for the production of contact fields and conductive layers. An additional advantage is the ability to selectively apply these layers on various substrates.

AB - The paper presents the methodology of producing layers with surface resistance in the range of 0.1 ÷ 10.0Ω / . It was found that the addition of copper reduces the final resistance. The paper specifies the optimal conditions for the production of these layers. The addition of copper makes the NiCuP alloy perfectly suitable for the production of contact fields and conductive layers. An additional advantage is the ability to selectively apply these layers on various substrates.

KW - NiCuP

KW - conductive layers

KW - resistive layers

KW - selective metallization

UR - https://www.scopus.com/pages/publications/85152097754

U2 - 10.15199/48.2023.04.38

DO - 10.15199/48.2023.04.38

M3 - Artykuł

AN - SCOPUS:85152097754

SN - 0033-2097

VL - 99

SP - 224

EP - 226

JO - Przeglad Elektrotechniczny

JF - Przeglad Elektrotechniczny

IS - 4

ER -

Warstwy NiCuP wytwarzane w procesie bezprądowej metalizacji

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