Abstract
The rapid evolution of microelectronics requires materials that combine exceptional strength, ductility, and electrical conductivity for joining applications and durable lithium-ion battery anodes. Nanotwinned Cu (nt-Cu) surpasses conventional strengthening approaches, which often compromise ductility and conductivity, by using nanoscale twin boundaries to enhance both mechanical and electrical properties. This review examines the thermomechanical characteristics, fabrication methods, multiscale mechanistic insights, and technological applications of nt-Cu, bridging fundamental science with engineering practice. Using an informatics-driven approach that incorporates advanced text mining and visualization techniques, this study elucidates key trends in the structural and mechanical properties of nt-Cu, advancing its application in cutting-edge joining technologies.
| Original language | English |
|---|---|
| Article number | 103630 |
| Journal | Advances in Colloid and Interface Science |
| Volume | 346 |
| DOIs | |
| Publication status | Published - Dec 2025 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 7 Affordable and Clean Energy
Keywords
- Copper
- Electrodeposition
- Electronic packaging
- Molecular dynamics
- Nanotwinning informatics
- Twin boundaries
ASJC Scopus subject areas
- Surfaces and Interfaces
- Physical and Theoretical Chemistry
- Colloid and Surface Chemistry
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