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Understanding the mechanothermally superior nanotwinned copper: Fabrication procedure, mechanistic models and technological applications

  • Zhijie Zhang
  • , Yulong Hu
  • , Xiangyu Li
  • , Fengjiang Wang
  • , Yi Li
  • , Anil Kunwar
  • Jiangsu University of Science and Technology
  • Xi'an Jiaotong University
  • Guangdong Academy of Sciences

Research output: Contribution to journalReview articlepeer-review

1 Citation (Scopus)

Abstract

The rapid evolution of microelectronics requires materials that combine exceptional strength, ductility, and electrical conductivity for joining applications and durable lithium-ion battery anodes. Nanotwinned Cu (nt-Cu) surpasses conventional strengthening approaches, which often compromise ductility and conductivity, by using nanoscale twin boundaries to enhance both mechanical and electrical properties. This review examines the thermomechanical characteristics, fabrication methods, multiscale mechanistic insights, and technological applications of nt-Cu, bridging fundamental science with engineering practice. Using an informatics-driven approach that incorporates advanced text mining and visualization techniques, this study elucidates key trends in the structural and mechanical properties of nt-Cu, advancing its application in cutting-edge joining technologies.

Original languageEnglish
Article number103630
JournalAdvances in Colloid and Interface Science
Volume346
DOIs
Publication statusPublished - Dec 2025

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 7 - Affordable and Clean Energy
    SDG 7 Affordable and Clean Energy

Keywords

  • Copper
  • Electrodeposition
  • Electronic packaging
  • Molecular dynamics
  • Nanotwinning informatics
  • Twin boundaries

ASJC Scopus subject areas

  • Surfaces and Interfaces
  • Physical and Theoretical Chemistry
  • Colloid and Surface Chemistry

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