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The causes of high power diode laser brazed seams fractures of dissimilar materials

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Presented in this article are the results of experiments carried out to determine the causes of braze cracking of dissimilar materials brazed with a ROFIN DL 020 high power diode laser with the use of additional powdered EN AW-1070A aluminium alloy to bond thin aluminium sheets with soft, low alloy DC04+ZE75/75 steel plate which was electrolytically coated with zinc on both sides. Presented are the results of metallographic, macroscopic, microscopic, diffractometric phase analyses of the weld joints. Metallurgical problems arising during processing as well as suggestions regarding technical aspects of laser brazing dissimilar materials in regards to their physical characteristics and chemical composition are explored.

Original languageEnglish
Title of host publicationLaser Technology 2016
Subtitle of host publicationProgress and Applications of Lasers
EditorsRyszard S. Romaniuk, Jan K. Jabczynski
PublisherSPIE
ISBN (Electronic)9781510607767
DOIs
Publication statusPublished - 2016
Event11th Symposium on Laser Technology: Progress and Applications of Lasers, SLT 2016 - Jastarnia, Poland
Duration: 27 Sept 201630 Sept 2016

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume10159
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

Conference11th Symposium on Laser Technology: Progress and Applications of Lasers, SLT 2016
Country/TerritoryPoland
CityJastarnia
Period27/09/1630/09/16

Keywords

  • Aluminium
  • Brittle cracking
  • Difficult to weld materials
  • Dissimilar material joints
  • Galvanized steel welding
  • High power diode laser
  • Intermetallic phases
  • Laser brazing
  • Steel

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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