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Refinement of the Cu structure by oscillatory compression test

  • University of Silesia in Katowice

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Polycrystalline Cu has been deformed at room temperature by oscillatory compression method to true reduction εh = 0.6 and 1. Microstructure by using transmission electron microscopy (TEM) and texture evolution after deformations was investigated. Oscillatory compressed microareas contains two distinctive regions: fine grains inside banded microstructure with large misorientation and surrounding matrix with submicrometer subgrains with a fraction of both low and high angle boundaries. Moreover nucleation of new grains under recrystallization takes place at the local-regions. The study of the crystal orientation distribution during applied deformation showed that the pole figure registered for the sample after compression shows ring of pole density, which concentrates around projection of <011>. Oscillatory compression causes formation of two axial texture components: <001> and <011>.

Original languageEnglish
Title of host publicationApplied Crystallography XX
EditorsDanuta Stroz, Małgorzata Karolus
PublisherTrans Tech Publications Ltd.
Pages111-115
Number of pages5
ISBN (Print)9783908451402
DOIs
Publication statusPublished - 2007
Event20th Conference on Applied Crystallography, 2006 - Wisla, Poland
Duration: 11 Sept 200614 Sept 2006

Publication series

NameSolid State Phenomena
Volume130
ISSN (Print)1012-0394
ISSN (Electronic)1662-9779

Conference

Conference20th Conference on Applied Crystallography, 2006
Country/TerritoryPoland
CityWisla
Period11/09/0614/09/06

Keywords

  • Copper
  • Fine-grained microstructure
  • Severe plastic deformation
  • Texture

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • General Materials Science
  • Condensed Matter Physics

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