TY - GEN
T1 - NOISE TRANSMISSION THROUGH DEVICE CASINGS – DESIGN OF OPENINGS
AU - Maamoun, Khaled Said Ahmed
AU - Pawelczyk, Marek
AU - Wrona, Stanislaw
N1 - Publisher Copyright:
© 2024 Proceedings of the International Congress on Sound and Vibration. All rights reserved.
PY - 2024
Y1 - 2024
N2 - One of the tasks of device casings is to reduce the noise they transmit. However, sometimes the casings must also allow for adequate heat exchange or even airflow. To this end, openings are used in them. An opening in an enclosure is in turn associated with the transmission of noise. The aim of this paper is to analyse various design solutions to reduce the transmitted noise with given restrictions, for example with regard to the required air flow. The article contains both theoretical considerations and experimental studies. Conclusions can be drawn as to which arrangement of openings is most favourable and, if necessary, which other design solutions are most advantageous. The results obtained can provide valuable guidance for equipment designers.
AB - One of the tasks of device casings is to reduce the noise they transmit. However, sometimes the casings must also allow for adequate heat exchange or even airflow. To this end, openings are used in them. An opening in an enclosure is in turn associated with the transmission of noise. The aim of this paper is to analyse various design solutions to reduce the transmitted noise with given restrictions, for example with regard to the required air flow. The article contains both theoretical considerations and experimental studies. Conclusions can be drawn as to which arrangement of openings is most favourable and, if necessary, which other design solutions are most advantageous. The results obtained can provide valuable guidance for equipment designers.
KW - Sound power estimation
KW - Vibrating plates with openings
KW - Vibro-acoustic systems
UR - https://www.scopus.com/pages/publications/85205340651
M3 - Conference contribution
AN - SCOPUS:85205340651
T3 - Proceedings of the International Congress on Sound and Vibration
BT - Proceedings of the 30th International Congress on Sound and Vibration, ICSV 2024
A2 - van Keulen, Wim
A2 - Kok, Jim
PB - Society of Acoustics
T2 - 30th International Congress on Sound and Vibration, ICSV 2024
Y2 - 8 July 2024 through 11 July 2024
ER -