Abstract
This paper discuses frequency properties of power delivery network impedance in multi-layer printed circuit boards. The influence of layer stackup and decoupling capacitors placement are illustrated as result of full-wave analysis performed by means of HyperLynx Power Integrity simulation software.
| Translated title of the contribution | Analiza wpływu rozmieszczenia płaszczyzn odniesienia i kondensatorów odsprzęgających na impedancję obwodów zasilania wielowarstwowych obwodów drukowanych |
|---|---|
| Original language | English |
| Pages (from-to) | 66-69 |
| Number of pages | 4 |
| Journal | Przeglad Elektrotechniczny |
| Volume | 94 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 2018 |
Keywords
- Power delivery network
- Printed circuit board
ASJC Scopus subject areas
- Electrical and Electronic Engineering
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