Abstract
The article presents the results of the authors work on the application of layers based on Ni-P alloy in electronics. The authors proved that these layers can be used to make conductive and resistive paths on ceramic and silicon substrates. The innovativeness of the work carried out is expressed in the combination of electroless metallization technology and photochemical technology for selective deposition of layers of any shape.
| Translated title of the contribution | Warstwy przewodzące i rezystancyjne na bazie stopu Ni-P wykonane metodą selektywnej metalizacji |
|---|---|
| Original language | English |
| Pages (from-to) | 188-191 |
| Number of pages | 4 |
| Journal | Przeglad Elektrotechniczny |
| Volume | 2023 |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - 2023 |
Keywords
- Ni-P alloy
- conductive layers
- resistive layers
- selective metallization
ASJC Scopus subject areas
- Electrical and Electronic Engineering
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