Surface Functionalization Lab

Lab supervisor:
Anna Taratuta, PhD, Eng.
[email protected]

The laboratory is equipped with two types of ultra-thin film and coating equipment:
-Atomic Layer Deposition (ALD)
-Physical Vapour Deposition (PVD)

Atomic Layer Deposition (ALD)
Beneq TFS200 – Single atomic layer deposition system
-The system is capable of producing thin films at temperatures of up to 500°C
-The process takes place in a nitrogen atmosphere of 5.0 mbar
-Internal chamber dimensions: diameter 200mm, height 90mm
-We have a wide range of precursors, such as: zinc, tin, aluminium, titanium, zirconium, tantalum
-The layer can consist of one or more of the precursors or their oxides
-It is possible to control both the quantity and the duration of each cycle

Beneq TFS200 parameters:
-2 chambers 200 mm x 95 mm
-1 chamber 200 mm x 18 mm
-4 liquid sources
-2 heated sources
-2 gas lines
-O3 delivery system
-Nanoparticle coating module
-Excellent adhesion – chemisorption
-Sequentiality
-Repeatability
-High throughput
-Low process temperature
-Controlled thickness

Physical Vapour Deposition (PVD)
Physical Vapour Deposition (PVD) system equipped with a magnetron sputtering module.
-The basic pressure in the chamber is 5×10-7 mbar – UHV (Ultra High Vacuum) standard
-Possibility to install up to 3 magnetron guns and two types of DC and RF power supply, together with a co-deposition module and gas lines for nitrogen and oxygen
-Chamber, showing magnetron sputtering source in operation

Moorfield’s system, the nanoPVD-S10A, is a magnetron sputtering system for sputtering metals or insulating materials such as oxides and nitrides. The systems are equipped with turbomolecular pumping systems to ensure low contamination operation. Co-deposition is possible, as well as reactive sputtering using a gas/pressure control module that can handle up to three process gases. The system works with classic industrial targets (e.g. TiN, TiO2, C) and substrates up to 4″ in size.